ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,017, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and semiconductor chip... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,018, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method of marking semiconductor package" was i... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,019, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Kanggyu... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,020, issued on Aug. 4, was assigned to MITSUI HIGH-TEC INC. (Fukuoka, Japan). "Metal component including phosphorous-containing nickel layer... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,021, issued on Aug. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Substrate-on-die package architecture" was invented by Rajen Muruga... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,022, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of formi... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,023, issued on Aug. 4, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan) ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,024, issued on Aug. 4, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board" was invented by Se Woong Na (Seoul, South K... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,025, issued on Aug. 4, was assigned to The Florida International University Board of Trustees (Miami). "Scalable electronics manufacturing w... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,026, issued on Aug. 4, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Semiconductor package" was invented by Hyun Sun Lee (Seoul... Read More